Japanese Government Invests $3.89 Billion in Rapidus’ 2nm Process Technology

Government Aid of $3.9 Billion Approved for Rapidus in Support of 2nm, Multi-Chiplet Technologies

Japan-based Rapidus is working on developing 2nm process technology with the aim of commercializing it by 2027. To support its projects, the Japanese government has awarded Rapidus a significant grant worth ¥590 billion yen ($3.89 billion). This funding will be used for various purposes, including developing the 2nm production node and purchasing cleanroom equipment, among others.

Rapidus’ ambitious goals are now better supported with the added government funding, bringing its total support from the government to ¥920 billion ($6.068 billion). The entire project is estimated to cost around ¥5 trillion ($32.983 billion), but Rapidus is optimistic about securing the necessary financing with the support from major corporations like Toyota Motor and Nippon Telegraph and Telephone.

The company aims to begin testing its production in April 2025, followed by large-scale production in 2027. Commercial production of 2nm chips is expected to begin in that same year. Alongside collaborating with IBM to develop the fabrication process and building its manufacturing facility, Rapidus is also focusing on advanced packaging technology for multi-chiplet system-in-packages (SiPs). The latest government subsidies include more than ¥50 billion ($329.85 million) for research and development in this area, marking a first for Japan in providing subsidies for such technologies.

Notably, Rapidus will utilize a section of Seiko Epson Corporation’s Chitose Plant for its back-end packaging processes. This plant is located near Rapidus’ fab in Bibi World, an industrial park in Chitose City where pilot-stage research and development activities will take place. Through collaborations and financial support, Rapidus is confident in its ability to revolutionize the semiconductor industry with its cutting-edge technology.

In summary, Rapidus’ ambitious goal of commercializing 2nm process technology by 2027 has been boosted by significant government funding worth $3.89 billion yen ($31 million USD). With this support from both government and major corporations like Toyota Motor and Nippon Telegraph and Telephone, Rapidus aims to commence testing production by April 2025 while focusing on advanced packaging technology for SiPs through collaboration with IBM and utilizing Seiko Epson Corporation’s Chitose Plant for back-end processes.

Japan-based Rapidus is working on developing 2nm process technology with the aim of commercializing it by 2027. To support its projects, the Japanese government has awarded Rapidus a significant grant worth ¥590 billion yen ($3.89 billion). This funding will be used for various purposes, including developing the 2nm production node and purchasing cleanroom equipment, among…

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